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WS27C512L-20CMB Part of Waferscale Integration Inc with NSN 5962013332528 - Buy Now

Part No. : WS27C512L-20CMB
Alternate P/N: WS27C512L20CMB
CAGE Code : 66579
Item Name : microcircuit memory
NA

Part Number WS27C512L-20CMB having (CAGE Code 66579) and FSC 5962 Microcircuits Electronic in stock with ready to ship. Get an instant quote for WS27C512L-20CMB Microcircuit Memory by Waferscale Integration Inc. Fill the form below with your desired order quantity, targeted price and the expected order-fulfilment date. Our dedicated account manager will get back to you within 15 minutes.


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This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without CAGE code 6RE77 is void.

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ASAP AOG is a eminent WS27C512L-20CMB aircraft parts supplier to OEM, repair depot and other aviation sector. We are open for 7 days a week, 24 hours a day with instant Aircraft on Ground Support. All bill of materials can be sent via email to sales@asapaog.com in an excel format. Please feel free to call us at +1-714-705-4780.

NSN Information for Part Number WS27C512L-20CMB with NSN 5962-01-333-2528, 5962013332528

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-333-2528

Item Description:

Microcircuit Memory

59620133325280ND
CIICHCCESDPMICCriticalityENAC
7DA0
Part NumberISCRNVCRNCCHCCMSDSSADC
Ws27c512l-20cmb195

Characteristics Data of NSN 5962-01-333-2528, 5962013332528

MRCCriteriaCharacteristic
ADATBODY WIDTH0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING350.0 MILLIWATTS
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CQWXOUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CTQXCURRENT RATING PER CHARACTERISTIC60.00 MILLIAMPERES MAXIMUM SUPPLY
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQYTERMINAL TYPE AND QUANTITY32 LEADLESS
CQSJINCLOSURE MATERIALCERAMIC
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
CTFTCASE OUTLINE SOURCE AND DESIGNATORC-12 MIL-M-38510
ADAQBODY LENGTH0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
ADAUBODY HEIGHT0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CQZPINPUT CIRCUIT PATTERN26 INPUT
CZEQTIME RATING PER CHACTERISTIC200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPEEPROM

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