MRC | Criteria | Characteristic |
---|
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND 3-STATE OUTPUT AND SCHOTTKY" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT" |
CSSL | DESIGN FUNCTION AND QUANTITY | 8 BUFFER, NONINVERTING" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 6.50 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 7.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI" |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS" |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/332 GOVERNMENT SPECIFICATION" |
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND 3-STATE OUTPUT AND SCHOTTKY" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT" |
CSSL | DESIGN FUNCTION AND QUANTITY | 8 BUFFER, NONINVERTING" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 6.50 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 7.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI" |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS" |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/332 GOVERNMENT SPECIFICATION" |