MRC | Criteria | Characteristic |
---|
AAQL | BODY STYLE | W/MTG TABS/FLANGES TERMINAL(S) ON ONE SURFACE" |
AARG | RELIABILITY INDICATOR | NOT ESTABLISHED" |
ABTD | MOUNTING SLOT WIDTH | 0.156 INCHES NOMINAL" |
ADAQ | BODY LENGTH | 1.750 INCHES NOMINAL" |
ADAT | BODY WIDTH | 0.640 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 2.000 INCHES NOMINAL" |
AEBY | DISTANCE BETWEEN CENTERLINES OF MOUNTING FACILITIES PARALLEL TO BODY LENGTH | 2.125 INCHES NOMINAL" |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S)" |
AXHR | MOUNTING FACILITY TYPE AND QUANTITY | 1 MOUNTING SLOTS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE" |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 20.0 MEGOHM-MICROFARADS" |
CQBQ | III CAPACITANCE VALUE PER SECTION | 0.500 MICROFARADS SINGLE SECTION" |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 85.0 DEG CELSIUS MAXIMUM" |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 600.0 DC SINGLE SECTION" |
CRTP | TOLERANCE RANGE PER SECTION | -10.00 TO 10.00 PERCENT SINGLE SECTION" |
CWJK | CASE MATERIAL | METAL" |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 2000.0 MEGOHM-MICROFARADS" |
CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 1.0000" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
TEST | TEST DATA DOCUMENT | 81349-MIL-C-25 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING" |
TTQY | TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG" |
AAQL | BODY STYLE | W/MTG TABS/FLANGES TERMINAL(S) ON ONE SURFACE" |
AARG | RELIABILITY INDICATOR | NOT ESTABLISHED" |
ABTD | MOUNTING SLOT WIDTH | 0.156 INCHES NOMINAL" |
ADAQ | BODY LENGTH | 1.750 INCHES NOMINAL" |
ADAT | BODY WIDTH | 0.640 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 2.000 INCHES NOMINAL" |
AEBY | DISTANCE BETWEEN CENTERLINES OF MOUNTING FACILITIES PARALLEL TO BODY LENGTH | 2.125 INCHES NOMINAL" |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S)" |
AXHR | MOUNTING FACILITY TYPE AND QUANTITY | 1 MOUNTING SLOTS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE" |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 20.0 MEGOHM-MICROFARADS" |
CQBQ | III CAPACITANCE VALUE PER SECTION | 0.500 MICROFARADS SINGLE SECTION" |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 85.0 DEG CELSIUS MAXIMUM" |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 600.0 DC SINGLE SECTION" |
CRTP | TOLERANCE RANGE PER SECTION | -10.00 TO 10.00 PERCENT SINGLE SECTION" |
CWJK | CASE MATERIAL | METAL" |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 2000.0 MEGOHM-MICROFARADS" |
CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 1.0000" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
TEST | TEST DATA DOCUMENT | 81349-MIL-C-25 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING" |
TTQY | TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG" |