MRC | Criteria | Characteristic |
---|
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.1 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | BIPOLAR AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND W/CLOCK AND BIDIRECTIONAL AND 3-STATE OUTPUT AND PROGRAMMED AND ELECTROSTATIC SENSITIVE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | REGISTERED AND-OR GATE ARRAY - PAL CPU CONTROL" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | PAL" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS" |
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.1 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | BIPOLAR AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND W/CLOCK AND BIDIRECTIONAL AND 3-STATE OUTPUT AND PROGRAMMED AND ELECTROSTATIC SENSITIVE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | REGISTERED AND-OR GATE ARRAY - PAL CPU CONTROL" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | PAL" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS" |