MRC | Criteria | Characteristic |
---|
ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM" |
ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM" |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND MONOLITHIC" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 20 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 210.00 MILLIAMPERES MAXIMUM SUPPLY" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR INVERT GATE ARRAY" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY" |
CZER | MEMORY DEVICE TYPE | PROGRAMMED" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM" |
ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM" |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND MONOLITHIC" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 20 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 210.00 MILLIAMPERES MAXIMUM SUPPLY" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR INVERT GATE ARRAY" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY" |
CZER | MEMORY DEVICE TYPE | PROGRAMMED" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |