NSN 5962-01-306-5562 (5962013065562) Microcircuit Memory Parts Catalog

The part belongs to NSN 5962-01-306-5562 is an Microcircuit Memory produced by Xicor Inc, Seeq Technology Inc, Atmel Corp, Dla Land And Maritime, Honeywell International Inc. This specific NSN is a numeric identifier assigned by the Defense Logistics Agency (DLA) to categorize all products distributed by the NATO federal supply chain. At ASAP AOG, a company owned and operated by ASAP Semiconductor, we possess parts that belong to the NSN 5962-01-306-5562 and these are readily available in our current inventory. Our on-hand inventory contains parts belonging to this particular NSN that you can easily access. So, if you need an Microcircuit Memory made by Xicor Inc, Seeq Technology Inc, Atmel Corp, Dla Land And Maritime, Honeywell International Inc that carries the NSN 5962-01-306-5562, you can rely on us to provide you with the necessary parts from our available inventory.

At ASAP AOG, we are dedicated to providing competitive quotes for premium NATO parts. We work hard to ensure all the national stock number 5962013065562 parts are fully certified and up to standard. Our supply chain is extensive and one of the fastest in the industry. Have a question or need a quote today? Simply fill out the RFQ below.

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	1.490 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	1.0 WATTS"
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS"
AGAV	END ITEM IDENTIFICATION	1270-01-142-2855 TARGET DESIGNAT"
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE"
CQSJ	INCLOSURE MATERIAL	CERAMIC"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	26 INPUT"
CTFT	CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510"
CTQX	CURRENT RATING PER CHARACTERISTIC	80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.25 VOLTS MAXIMUM TOTAL SUPPLY"
CZEQ	TIME RATING PER CHACTERISTIC	250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"
CZER	MEMORY DEVICE TYPE	EEPROM"
CZZZ	MEMORY CAPACITY	UNKNOWN"
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)."
TTQY	TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT"
ADAQ	BODY LENGTH	1.490 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	1.0 WATTS"
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS"
AGAV	END ITEM IDENTIFICATION	1270-01-142-2855 TARGET DESIGNAT"
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE"
CQSJ	INCLOSURE MATERIAL	CERAMIC"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	26 INPUT"
CTFT	CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510"
CTQX	CURRENT RATING PER CHARACTERISTIC	80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.25 VOLTS MAXIMUM TOTAL SUPPLY"
CZEQ	TIME RATING PER CHACTERISTIC	250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"
CZER	MEMORY DEVICE TYPE	EEPROM"
CZZZ	MEMORY CAPACITY	UNKNOWN"
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)."
TTQY	TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT"

MRC

Criteria

Characteristic

ADAQ

BODY LENGTH

1.490 INCHES MAXIMUM"

ADAT

BODY WIDTH

0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM"

ADAU

BODY HEIGHT

0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM"

AEHX

MAXIMUM POWER DISSIPATION RATING

1.0 WATTS"

AFGA

OPERATING TEMP RANGE

-55.0/+125.0 DEG CELSIUS"

AFJQ

STORAGE TEMP RANGE

-65.0/+150.0 DEG CELSIUS"

AGAV

END ITEM IDENTIFICATION

1270-01-142-2855 TARGET DESIGNAT"

CBBL

FEATURES PROVIDED

HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE"

CQSJ

INCLOSURE MATERIAL

CERAMIC"

CQSZ

INCLOSURE CONFIGURATION

DUAL-IN-LINE"

CQWX

OUTPUT LOGIC FORM

COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC"

CQZP

INPUT CIRCUIT PATTERN

26 INPUT"

CTFT

CASE OUTLINE SOURCE AND DESIGNATOR

D-10 MIL-M-38510"

CTQX

CURRENT RATING PER CHARACTERISTIC

80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY"

CWSG

TERMINAL SURFACE TREATMENT

SOLDER"

CZEN

VOLTAGE RATING AND TYPE PER CHARACTERISTIC

6.25 VOLTS MAXIMUM TOTAL SUPPLY"

CZEQ

TIME RATING PER CHACTERISTIC

250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"

CZER

MEMORY DEVICE TYPE

EEPROM"

CZZZ

MEMORY CAPACITY

UNKNOWN"

TEST

TEST DATA DOCUMENT

96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)."

TTQY

TERMINAL TYPE AND QUANTITY

28 PRINTED CIRCUIT"