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NSN 5962-01-227-9026 (5962012279026) Microcircuit Memory Parts Catalog

The part belongs to NSN 5962-01-227-9026 is an Microcircuit Memory produced by Integrated Device Technology Inc, General Dynamics C4 Systems Inc. This specific NSN is a numeric identifier assigned by the Defense Logistics Agency (DLA) to categorize all products distributed by the NATO federal supply chain. At ASAP AOG, a company owned and operated by ASAP Semiconductor, we possess parts that belong to the NSN 5962-01-227-9026 and these are readily available in our current inventory. Our on-hand inventory contains parts belonging to this particular NSN that you can easily access. So, if you need an Microcircuit Memory made by Integrated Device Technology Inc, General Dynamics C4 Systems Inc that carries the NSN 5962-01-227-9026, you can rely on us to provide you with the necessary parts from our available inventory.


At ASAP AOG, we are dedicated to providing competitive quotes for premium NATO parts. We work hard to ensure all the national stock number 5962012279026 parts are fully certified and up to standard. Our supply chain is extensive and one of the fastest in the industry. Have a question or need a quote today? Simply fill out the RFQ below.


Alternative NSN: 5962-01-227-9026
Item Name: Microcircuit Memory
FSG: 59 Electrical and Electronic Equipment Components
Federal Supply Class (FSC): 5962 Microcircuits Electronic
NCB Code: USA (01)
Manufacturers: General Dynamics C4 Systems Inc, Integrated Device Technology Inc

Manufacturer’s List for NSN 5962-01-227-9026

general dynamics c4 systems inc integrated device technology inc

Part Number's List for NSN 5962-01-227-9026

Part No.
Manufacturer
Item Name
Availability
RFQ

Technical Characteristics of NSN 5962012279026

MRCCriteriaCharacteristic
MEMORYADAQBODY LENGTH0 450 INCHES NOMINAL
MEMORYADATBODY WIDTH0 450 INCHES NOMINAL
MEMORYADAUBODY HEIGHT0 085 INCHES MAXIMUM
MEMORYAFGAOPERATING TEMP RANGE-55 0 TO 125 0 DEG CELSIUS
MEMORYAFJQSTORAGE TEMP RANGE-65 0 TO 150 0 DEG CELSIUS
MEMORYCBBLFEATURES PROVIDEDWENABLE AND HERMETICALLY SEALED AND MONOLITHIC
MEMORYCQSJINCLOSURE MATERIALCERAMIC
MEMORYCQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORYCQWXOUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
MEMORYCQZPINPUT CIRCUIT PATTERN22 INPUT
MEMORYCRHLBIT QUANTITY16384
MEMORYCSWJWORD QUANTITY2048
MEMORYCWSGTERMINAL SURFACE TREATMENTSOLDER
MEMORYCZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC7 0 VOLTS MAXIMUM POWER SOURCE
MEMORYCZERMEMORY DEVICE TYPERAM
MEMORYTESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC
MEMORYTTQYTERMINAL TYPE AND QUANTITY28 LEADLESS