MRC | Criteria | Characteristic |
---|
AAQL | BODY STYLE | CHIP TYPE" |
AARG | RELIABILITY INDICATOR | ESTABLISHED" |
AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.001" |
ABJT | TERMINAL LENGTH | 0.020 INCHES NOMINAL" |
ADAQ | BODY LENGTH | 0.080 INCHES NOMINAL" |
ADAT | BODY WIDTH | 0.050 INCHES NOMINAL" |
ADAU | BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.055 INCHES MAXIMUM" |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S)" |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS" |
CQBQ | CAPACITANCE VALUE PER SECTION | 12.000 PICOFARADS SINGLE SECTION" |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM" |
CQLZ | TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 0.0 SINGLE SECTION" |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 100.0 DC SINGLE SECTION" |
CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -30.0 TO 30.0 SINGLE SECTION" |
CRTP | TOLERANCE RANGE PER SECTION | -5.00 TO 5.00 PERCENT SINGLE SECTION" |
CWJK | CASE MATERIAL | CERAMIC" |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS" |
CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.150" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
TEST | TEST DATA DOCUMENT | 81349-MIL-C-55681 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI" |
TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD" |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-C-55681/1 GOVERNMENT SPECIFICATION" |
AAQL | BODY STYLE | CHIP TYPE" |
AARG | RELIABILITY INDICATOR | ESTABLISHED" |
AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.001" |
ABJT | TERMINAL LENGTH | 0.020 INCHES NOMINAL" |
ADAQ | BODY LENGTH | 0.080 INCHES NOMINAL" |
ADAT | BODY WIDTH | 0.050 INCHES NOMINAL" |
ADAU | BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.055 INCHES MAXIMUM" |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S)" |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS" |
CQBQ | CAPACITANCE VALUE PER SECTION | 12.000 PICOFARADS SINGLE SECTION" |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM" |
CQLZ | TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 0.0 SINGLE SECTION" |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 100.0 DC SINGLE SECTION" |
CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -30.0 TO 30.0 SINGLE SECTION" |
CRTP | TOLERANCE RANGE PER SECTION | -5.00 TO 5.00 PERCENT SINGLE SECTION" |
CWJK | CASE MATERIAL | CERAMIC" |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS" |
CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.150" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
TEST | TEST DATA DOCUMENT | 81349-MIL-C-55681 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI" |
TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD" |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-C-55681/1 GOVERNMENT SPECIFICATION" |